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Back Grinding Machines In Seminductor

Request Wafer Backgrinding Quote Wafer grinding also called wafer thinning is a process performed during the semiconductor manufacturing to reduce wafer thickness This manufacturing step is essential in producing the ultrathin wafers required for stacking and highdensity packaging in portable and handheld devices

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  • Semiconductor BackGrinding
    Semiconductor BackGrinding

    Semiconductor BackGrinding The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as flat

  • Wholesale Semiconductor Back Grinding  Semiconductor
    Wholesale Semiconductor Back Grinding Semiconductor

    Looking for semiconductor back grinding You’ve come to the right place This page is your semiconductor back grinding onestop source for the competitive prices and quality from sewing machine suppliers and manufacturers If you have a difficulty finding a right supplier post your Buying Leads for FREE now Get Listed

  • Wafer Backgrind  All About Semiconductor Manufacturing
    Wafer Backgrind All About Semiconductor Manufacturing

    The machine picks up the wafer from its backside untaped side with a robotic arm which positions the wafer for backgrinding The backgrinding process is automatically accomplished by a grinding wheel following a precise set of parameters to ensure proper backgrinding

  • Grinding Machine for Semiconductor Wafers
    Grinding Machine for Semiconductor Wafers

    Grinding Machines for Semiconductor Wafers Koyo Machine Industries developed several types of grinding machines used in the semiconductor industry for silicon wafer manufacturing and IC production Vertical and horizontal spindle systems are used in combination with special designed diamond grinding wheels that cut just at the edge of the rinding wheel resulting in high grinding

  • AM TECHNOLOGY  Back Grinding Machine P  L Division
    AM TECHNOLOGY Back Grinding Machine P L Division

    Korean machine industry platform Komachine introduces AM TECHNOLOGY Back Grinding Machine P L Division DG Division Laser Division Manufacturer of Fine grinding Dicing Wrapping Polishing Slicing Slot grinding MC Semiconductor

  • Back Grinding Machine for 12 Wafer  China Wafer Grinder
    Back Grinding Machine for 12 Wafer China Wafer Grinder

    Back Grinding Machine for 12 Wafer Find Details about Wafer Grinder Wafer Grinding Machine from Back Grinding Machine for 12 Wafer Guangzhou MinderHightech Co Ltd

  • Disco Back Grinding Machines  Products  Suppliers
    Disco Back Grinding Machines Products Suppliers

    ProductsServices for Disco Back Grinding Machines Grinders and Grinding Machines 971 companies Grinders and grinding machines use an abrasive that is bonded to a wheel belt or disc to remove material and improve surface finish

  • Wafer Backgrind  All About Semiconductor Manufacturing
    Wafer Backgrind All About Semiconductor Manufacturing

    Wafer Backgrind Wafer Backgrind is the process of grinding the backside of the wafer to the correct wafer thickness prior to assembly It is also referred to as wafer thinning Wafer backgrinding has not always been necessary but the drive to make packages thinner and thinner has made it indispensable

  • Wholesale Semiconductor Back Grinding  Semiconductor Back
    Wholesale Semiconductor Back Grinding Semiconductor Back

    This page is your semiconductor back grinding onestop source for the competitive prices and quality from sewing machine suppliers and manufacturers If you have a difficulty finding a right supplier post your Buying Leads for FREE now

  • Products for Back Grinding Process  AdwillSemiconductor
    Products for Back Grinding Process AdwillSemiconductor

    LINTEC Corporation Advanced Materials Operations 212 Koraku Bunkyoku Tokyo 1120004 Japan TEL81338687737 FAX81338687726

  • What is back grinding  네이버 블로그
    What is back grinding 네이버 블로그

    What is back grinding Semiconductor wafers are routinely thinned prior to dicing to aid the sawing operation and to allow the final assembled package thickness to be minimized For semiconductor devices required to operate at high power levels wafer thinning improves the ability to dissipate heat by lowering the thermal resistance of die

  • China Back Grinding Machine for 12 Wafer  China Wafer
    China Back Grinding Machine for 12 Wafer China Wafer

    Wafer Grinder Wafer Grinding Machine Back Grinder manufacturer supplier in China offering Back Grinding Machine for 12 Wafer Mobile Phone Double Drums Rollers Drop Continuous Rotation Tester Testing Machine Double Drums Rollers Drop Continuous Rotation Tester Testing Machine

  • Back Grinding Machine for 12 Wafer  China Wafer Grinder
    Back Grinding Machine for 12 Wafer China Wafer Grinder

    Back Grinding Machine for 12 Wafer Find Details about Wafer Grinder Wafer Grinding Machine from Back Grinding Machine for 12 Wafer Guangzhou MinderHightech Co Ltd

  • The backend process Step 3 – Wafer backgrinding  Solid
    The backend process Step 3 – Wafer backgrinding Solid

    With a 2000 grit grinding process the stress required to break the die was 50 percent higher than the stress needed to break a die with a larger 1200 grit grinding process Figure 2 shows the method of applying the test force to the die and Figure 3 shows the difference in the scratches on the wafers using different grits to grind the silicon

  • Semiconductor Manufacturing Equipment
    Semiconductor Manufacturing Equipment

    Probing machines perform electrical tests of each chip on a wafer ensuring the quality of semiconductor devices Polish Grinders Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process and offer various applications for peripheral processes in the one system

  • Introduction to Semico nductor Manufacturing and FA
    Introduction to Semico nductor Manufacturing and FA

    Back EndBE Process Wafer Back Grinding • The typical wafer supplied from ‘wafer fab’ is 600 to 750μm thick • Wafer thinned down to the required thickness 50um to 75um by abrasive grinding wheel › 1st step Use a large grit to coarsely grind the wafer and remove the bulk of the excess wafer thickness

  • back grinding process
    back grinding process

    surface grinding machine has been developed and introduced into the market where it is making a will be fed back to product development to ensure further Get Quote Introduction of Wafer Surface Grinding Machine Model surface grinding machine has been developed and introduced into the market where it is making a will be fed

  • Release of new model back grinding tape laminator  News
    Release of new model back grinding tape laminator News

    Apr 28 2017 · Back Grinding Tape Laminator “RAD3520F12” Improved performance in anticipation of new semiconductor demand for cuttingedge devices and IoT LINTEC develops and provides a tape laminator to protect the circuit surface of the wafer during the back grinding and thinning process of the semiconductor wafer after circuit formation

  • Disco Back Grinding Machines  Products  Suppliers
    Disco Back Grinding Machines Products Suppliers

    Insaco Inc Lens Grinding Polishing Specialized Lens Generating and Polishing Equipment allows Insaco to Manufacture a wide variety of Lens in Sapphire and other Optical Materials Since 1947 Insaco has been a precision machining and polishing fabricator of parts from all technical ceramics sapphire glass and quartz We machine these materials to very precise tolerances many times

  • Wafer Grinder Finishing  Grinding Machines  Koyo
    Wafer Grinder Finishing Grinding Machines Koyo

    Koyo Machinery is a world leader in the development and manufacturing of custom Centerless Surface and Specialty Grinders We repair and install specialty grinders for a variety of industries including Automotive Aerospace Bearing Construction Energy and Medical

  • AdwillSemiconductorrelated Products  LINTEC Corporation
    AdwillSemiconductorrelated Products LINTEC Corporation

    The LINTEC Adwill series includes UV curable dicing tapes high performance back grinding tapes dicing die bonding tapes required for semiconductor packaging and backside coating tapes Adwill continues to make steady progress in the advancement of related equipment and unique systems

  • Wafer Detaping Machineid887181 Buy Semiconductor Back
    Wafer Detaping Machineid887181 Buy Semiconductor Back

    There are 11 Semiconductor Back Grinding from 8 suppliers on Related Searches machine machinery oil purifier filter hardware cutting machine oil recycling oil filter

  • What is back grinding  네이버 블로그
    What is back grinding 네이버 블로그

    What is back grinding Semiconductor wafers are routinely thinned prior to dicing to aid the sawing operation and to allow the final assembled package thickness to be minimized For semiconductor devices required to operate at high power levels wafer thinning improves the ability to dissipate heat by lowering the thermal resistance of die

  • The backend process Step 3 – Wafer backgrinding  Solid
    The backend process Step 3 – Wafer backgrinding Solid

    One thought on “ The backend process Step 3 – Wafer backgrinding ” enrique December 15 2016 at 717 pm We suggest you the UV release tape for attach waferglass to grind and polish Once finish the grind and polish use UV irradiation on the waferglass the waferglass will easy picked up

  • config of a semiconductor wafer back grinding equipment
    config of a semiconductor wafer back grinding equipment

    Grinding Machines for Semiconductor Wafers Koyo Machine Industries developed several types of grinding machines used in the semiconductor industry for silicon wafer manufacturing and IC production Vertical and horizontal spindle systems are used in combination with special designed diamond grinding wheels that cut just at the edge of the

  • Wafer Back Grinding  네이버 블로그
    Wafer Back Grinding 네이버 블로그

    Semiconductor backgrinding The grinding process Reducing stresses and flaws The silicon wafer on which the active elements are created is a thin circular disc typically 150mm or 200mm in diameter During diffusion and similar processes the wafer may become bowed but wafers for assembly are normally stress relieved and can be regarded as

  • Grinding and Dicing Services Company  wafer grind
    Grinding and Dicing Services Company wafer grind

    GDSI Grinding and Dicing Services complete resource for Silicon Wafers Processing includes Probing Bumping Grinding Polishing in San Jose California Toggle navigation 408 4512000

  • Wafer grinding ultra thin TAIKO  dicinggrinding service
    Wafer grinding ultra thin TAIKO dicinggrinding service

    TAIKO is a DISCO developed wafer back grinding method By enabling an outer support ring to the wafer the TAIKO ring Japanese for drum back grinding is performed on the inner circular area of the wafer while leaving an edge of a few millimeters unprocessed

  • Ultrathin semiconductor wafer applications and processes
    Ultrathin semiconductor wafer applications and processes

    Front side grooves are cut in the wafer streets before back grinding Chip separation takes place during backside thinning when finally the front side grooves are opened If the last step is a backside spinetching process grooves are rounded by the etchant and possible residual microcracks are removed

  • Backgrinding  Nitto
    Backgrinding Nitto

    At Nitto various products meeting the advanced needs of numerous processes during electronic device production are created based on a wealth of experience and knowledge gained in the field of electric and electronic materials

  • Used Grinding Lapping  Polishing
    Used Grinding Lapping Polishing

    Machines in Used Grinding Lapping Polishing Machines in Used Grinding Lapping Polishing Search for manufacturer modal category or keyword Semiconductor and PCB Manufacturing Semiconductor Equipment Grinding Lapping Polishing DFG841 200mm wafer back grinder for sale in working condition Location

  • Grinding and Polishing  ASM International
    Grinding and Polishing ASM International

    Grinding and Polishing 37 Fig 41 Automatic grinding and polishing machine Subroutine 41 Cleaning Ceramographic Mounts After each abrasive step rinse each specimen in warm tap water Do not remove specimens from the holder if an automatic polishing machine is being used Use distilled or deionized water if the tap water is too hard

  • DISCO precision machines  dicinggrinding service
    DISCO precision machines dicinggrinding service

    Best Equipment for advanced DicingGrinding Service DISCO’s highquality precision technology guarantees excellent processing results Manufactured at the Kuwabata Plant in Hiroshima Prefecture DISCO’s precision dicing saws and grindingpolishing machines combined with etchers surface planers and AOI tools offer customers the highest level of quality

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